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Deuterium gas

Deuterium gas is an elemental substance of stable hydrogen isotopes with the molecular formula D₂. It is a colorless and odorless gas at room temperature and atmospheric pressure. Sharing similar chemical properties with hydrogen, it remains stable under normal conditions. Being flammable, it can form explosive mixtures when mixed with air. Its CAS number is 7782-39-0, and it is also known as heavy hydrogen gas. As a key raw material for high-end industries, it is mainly used in nuclear fusion experiments and the production of deuterated solvents for nuclear magnetic resonance. It is also widely applied in semiconductor wafer processing, laser technology, optical fiber manufacturing and industrial leak detection. Classified as a flammable and explosive hazardous material, it must be stored, transported and used in strict accordance with safety regulations by professional personnel.

Fluorine Gas

Pure fluorine refers to elemental fluorine gas (F₂). At room temperature and atmospheric pressure, it is a pale yellow toxic gas with a strong pungent odour. As the elemental substance with the strongest non-metallicity and oxidizing property in nature, it features extremely active chemical properties. Except for some noble gases, it can react violently with nearly all elements and compounds. It may cause fire or explosion when contacting combustibles, and is highly corrosive and toxic, classified as a high-risk chemical. Pure fluorine must be stored in specially made sealed containers. Strict safety regulations shall be followed during operation. It is widely used in semiconductor etching, high-end fluorine material synthesis, aerospace, military industry and fine chemical engineering, serving as an essential raw material for high-tech industries. Its handling and transportation must be conducted by qualified professionals.

Antimony Pentafluoride

Antimony pentafluoride, with the chemical formula SbF₅, is a colorless, transparent, viscous, oily liquid at room temperature. It has low boiling and melting points and is highly volatile. It is a typical strong Lewis acid with extremely high chemical reactivity; it can combine with fluoride ions to form a stable antimony hexafluoride anion. It is also the key raw material for the preparation of the superacid antimony fluoride, whose acidity far exceeds that of concentrated sulfuric acid. This product is highly corrosive and hygroscopic; it reacts violently with water, releasing corrosive fumes, and must be strictly isolated from moisture and stored in a sealed container. As a high-end catalytic raw material, its unique physicochemical properties make it widely used in fluorochemical catalysis, semiconductor processes, new energy materials, and the synthesis of high-end pharmaceutical intermediates, making it a key material in the specialty fine chemicals sector.

Hydrogen chloride

Hydrogen chloride is a critically important basic chemical, and its most representative form is hydrochloric acid when dissolved in water. In the electronics industry, high-purity hydrogen chloride gas—especially electronic-grade—is known as the “master sculptor” in semiconductor manufacturing.

Hydrogen bromide

Hydrogen bromide, like hydrogen chloride, belongs to the family of hydrogen halides; however, its chemical properties differ due to the introduction of the bromine atom, giving it a unique niche in high-end manufacturing. In the electronics industry, hydrogen bromide is primarily used in semiconductor dry etching processes—particularly for etching silicon and germanium materials.

Fluorine-nitrogen mixed gas

Fluorine-nitrogen mixture is a special mixed electronic gas blended with fluorine and nitrogen in specific proportions. It is a pale yellow gas with a pungent odor at room temperature. With active chemical properties, it combines the strong oxidizability of fluorine and the stabilizing effect of nitrogen. Nitrogen reduces the activity of fluorine and improves operational safety while retaining its functions for etching and cleaning. As a highly hazardous corrosive chemical, it is widely used in the semiconductor industry for chamber cleaning, wafer etching and thin film treatment. It requires strict control over purity and ratio. Special anti-corrosion equipment and standard safety procedures must be adopted during storage, transportation and operation
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